Solder failure in pure tin
We have problem about pure bright tin plated on brass, we found soldering failure (condition used 60/40 Pb/Sn flux, 400-420 oC, 3 sec.) when plated sample have insert in polypropylene after have soldering this layer was peel off. How I can solve this problem, Sorry about my English.
Matsushita Electric Works, Ayuthaya - Thailand
I suggest you should give a under coat of Nickel (3-5 microns) before plating bright Tin. Further, 60-40 can perform well at 230'c, you need not have such a high temperature for your operation. Hope this should help solve your problem.
As suggested by Karthik, use a Nickel undercoat and reduce the soldering temp. The liquidus temp for a pure tin alloy is 232°C and the liquidus temp of 60/40 is 188°C. Soldering at the temperatures you have stated will almost certainly be damaging to your tin plate. A nickel undercoat and a soldering temp of 230 should be sufficient.Rich Mosley
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