Nickel Sulfamate Plating Peeling: Serious Adhesion Issue

Summary for nickel sulfamate plating peeling Discussion

Nickel sulfamate plating peeling from copper is the core problem in this thread, with the question pointing to loss of adhesion at high temperatures. The excerpt provided does not include the actual technical replies, so no specific remedy or diagnosis can be attributed from the source text shown. Based on the title alone, the issue appears to concern whether the nickel sulfamate deposit, the copper surface preparation, or thermal stress is causing the peel. Because the answer content is missing from the excerpt, the discussion cannot be summarized beyond noting that Robert H Probert of Garner, North Carolina is the named poster and that the thread is about adhesion failure of nickel sulfamate on copper under heat.

nickel book
The Sulfamate Nickel How-To Guide

by David Crotty, PhD & Robert Probert

Q. We are nickel plating (using a nickel sulfamate bath) copper plates. The tanks use nickel sulfamate, boric acid, nickel chloride, and an anti-pitting additive. The etching for the copper plates is done using a sulfamic acid solution.

Recently, we have been experiencing an increased number of peeling incidents. It is happening on the end of the plate that sits lowest in the tank. They are small peels that show up after we flame test the plating (our plates are used in steel manufacturing, so they must withstand high heat).

The tanks are tested regularly, with no evidence of chemical imbalance in the solution. We originally assumed it was a preparation issue, but the platers follow all guidelines properly and consistently regarding etching.

I am starting to run out of ideas. Our only assumption left is that organics in the tanks are getting too high. Is this something that can cause peeling? Any other suggestions?

Nikolas Runyan
– Oil City, Pennsylvania
November 4, 2021


November 10, 2021

A. 1. The bottom of your flume is the high current density area, so if the tensile stress has climbed then the stress is pulling it up. Use your spiral contractometer and see if the stress is too high.
2. I remember some of your copper is loaded with zirconium and chromium which contributes to adhesion problem. Try to copper plate it first, check that for adhesion, then start the SN nickel.

robert probert
Robert H Probert
Robert H Probert Technical Services
supporting advertiser
Garner, North Carolina
probertbanner