Where theworld gathers for metal finishing
Q&As since 1989
-----
Electroless deposition of copper on steel
Q. Hello I'm a student and have to do my diploma work. In this I have the problem that I should cover a steel wire of a few millimeters diameter with copper. The diameter of the wire after deposition should be constant over the full length within about 1 micrometer. Therefore I thought about electroless deposition of the copper. Unfortunately I haven't found a satisfactory method until yet. Can anybody help me?
Mathias Langeneggerstudent - Burgdorf, Bern, Switzerland
2005
A. Hello, Mathias. Did you try the standard copper sulphate [on eBay or Amazon]immersion plating method (15 g/l CuSO4 with 0.5 ml/l H2SO4)? Did you try a formaldelhyde-reduced autocatalytic electroless copper (see Electroless Plating chapter of the Metal Finishing Guidebook for formulation). Good luck.
Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
2005
Q. Hello Ted. No I haven't tried the standard copper sulphate immersion plating method yet. But I'm going to do it. Despite I'm pretty sure that I'll face some problems with the surface. Because I've read that with a standard electroplating method you don't get a flat surface. I'm pretty sure that the deposit will be thicker at the end of the wire. I've read also that the electroless deposition gives a better distribution so I hope that the thickness of the deposit will vary only within 1 micrometer. But an electroplater told me that it is not possible to deposit electroless copper on steel. I'm not convinced about that. Because I found some literature in which it is described but it seems to be very difficult. Unfortunately I don't have the Metal Finishing Guidebook which you mentioned. So I can't look up what you mean by a "formaldelhyde-reduced autocatalytic electroless copper". Do you know if this method is suitable for my problem? So can you electroless deposit copper on steel with this solution? Could you tell me further information about this solution then?
Additional information: I rotate the wire respectively the cathode. The Anode has the shape of a cylinder with a hole inside in which the cathode is placed. In addition the method should be very simple and the thickness should be able to control. So that it is possible to say for example in 5sec. with this current you get a deposit with the thickness of 2 micrometers. Further the method should be as simple as possible because it'll be used in the industry. Therefore I thought this would be one more reason to favor the electroless method.
- Burgdorf, Bern, Switzerland
2005
A. The immersion method won't give you problems with surface distribution of the copper coating; it does not involve electroplating. The immersion method is a chemical replacement reaction on the surface and will stop once the surface is completely covered. The copper coating, however, will be very thin.
James Totter, CEF
- Tallahassee, Florida
2005
Contact s-systems, they have an e-less copper plating controller . The make-up of the bath is 3-4 oz/gal formaldehyde, 22-27 oz/gal EDTA, 7-9 oz/gal sodium hydroxide and copper sulphate, at about 105 millivolts with the s-systems controller.
Jason A. Bown
Sanmina-SCi, USA - Athens, Pennsylvania, USA
2005
Q. Can you provide more information about the s-system controller or their contact information?
Todd Skrocki- Michigan, USA
September 29, 2016
----
Ed. note: Jason hasn't been by for more than a decade, and Google did not easily find the info you seek; but if you search for "electroless copper controller" you will see a number of suppliers, including Macdermid.
Q, A, or Comment on THIS thread -or- Start a NEW Thread