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"Plating out / dummying a Nickel Bath"



2005

When plating out a nickel solution to remove metallic contaminants is it necessary to adjust the pH to any specific value to favour the deposition of zinc or copper? I have been told that pH is relevant but have not found any written references on this subject.

Tony van der Spuy
- Cape Town, South Africa
^


2005

When dummying to remove copper and zinc, a pH towards the high side, say 4.5 -4.8 will help a bit.

jeffrey holmes
Jeffrey Holmes, CEF
Spartanburg, South Carolina
^


First of two simultaneous responses -- 2005

Hi Tony,
Ofcourse pH is relevant. At pH 2.7 to 3.5, ions of contaminants of metals like zinc and copper at low voltage/amperage (1V/0.2 amp/dm2) move faster than nickel ion. Hence, dummying at lower pH and lower voltage will give faster effect and remove the impurities of nickel bath.

t k mohan
T.K. Mohan
plating process supplier - Mumbai, India
^


Second of two simultaneous responses -- 2005

Tony,

The Ph 3,5-4,5 and controll the Ph when you dummying the solution because the Ph will enhancementin the nickel solution under the time you dummying.

Regards,

Anders Sundman
Anders Sundman
4th Generation Surface Engineering
Consultant - Arvika,
Sweden

^


2005

Tony,

To remove copper and zinc from nickel plating solution current density of dummy electrolysis is more important. Because of decomposition potential, copper and zinc has the tendency to deposit at 0.1 to 0.2 A/dm2.

Regards,

Venkat Raja
- Kitchener, Ontario, Canada
^

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