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Electroless nickel plating is not adhering to CuW

I am responsible for a project of surface finishing on 20Cu80W or 10Cu90W substrate. The finish is 2 µm Au / 2 µm El Ni / CuW. I use Pd as catalyst for El Ni. Ni layer peel off during thermal testing (room temp. to 400 C).

Would you have suggestion to improve the adhesion?

Thanks

Benny Hong
optoelectronic mfgr - Hong Kong,
2003

Hi, Benny. Getting adhesion on tungsten is very difficult because it is a refractory metal, but strong acids, followed by nickel strike, followed by diffusion often work; the ASM Metals Handbook, Vol. 5 has a great chapter on the subject. Good luck.

Regards,

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
September 23, 2009

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