Ultrasonic and air bubble in plating bath
I want to reduce the non-plating problem caused by air or hydrogen bubble in nickel plating bath for PCB.
My Question is:
1. Is ultrasonic effective to separate bubble from the metal surface?
2. Can in affect any property of plated metal layer?
Thank you,Sang Hyun Jeon
- Osan, Korea
I don't think you want ultrasonics (it actually creates bubbles). Try adding a surfactant to the bath; you can probably purchase it from your nickel bath supplier.
- Tallahassee, Florida
The answer is yes to both. The bubble gets broken down by the ultrasonic and increases plating speed substantially. The coating is much harder (I haven't measured it so I can't commit).
This may aggravate the problem actually for your PCBs with faster edge build up on your holes. I have used Reverse pulse plating to great advantage and I would say that is the way to go.
Bangalore, Karnataka, India
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