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topic 9957

Post reflow solderability requirement


(2001)

What underplate/thickness and Sn/Pb overplate composition/thickness would one plate tellurium copper base pin material in order to pass IPC J-STD-200 solderability testing after the pin has been subjected to at least two convection oven reflow passes (230 deg C peak temperature for approx. 2-3 min in air).

Duane Dixon
- Tucson, Arizona, USA


(2001)

I don't know the specification, but I would say 4 tenths of sulfamate or Watts nickel, 3 tenths of cyanide copper and 2 tenths (mil) of solder.

pooky
tom pullizi signature
Tom Pullizzi
Falls Township, Pennsylvania



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