-- The Home Page of the Finishing Industry
Serious Education & the most FUN
you can have in metal finishing smiley

No popups, spam, registration or passwords
on this site
current topics
topic 9957

Post reflow solderability requirement


What underplate/thickness and Sn/Pb overplate composition/thickness would one plate tellurium copper base pin material in order to pass IPC J-STD-200 solderability testing after the pin has been subjected to at least two convection oven reflow passes (230 deg C peak temperature for approx. 2-3 min in air).

Duane Dixon
- Tucson, Arizona, USA


I don't know the specification, but I would say 4 tenths of sulfamate or Watts nickel, 3 tenths of cyanide copper and 2 tenths (mil) of solder.

pooky tom pullizi signature
Tom Pullizzi
Falls Township, Pennsylvania

If you have a question in mind which seems off topic, please Search the Site

ADD a Comment to THIS thread START a NEW threadView CURRENT TOPICS

Disclaimer: It's not possible to diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations may be deliberately harmful.

  If you need a product/service, please check these Directories:

JobshopsCapital Equip. & Install'nChemicals & Consumables Consult'g, Train'g, SoftwareEnvironmental ComplianceTesting Svcs. & Devices

©1995-2018, Inc., Pine Beach, NJ   -   About   -  Privacy Policy
How Google uses data when you visit this site.