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Seed layer on PMMA and polycarbonate for electroless nickel or copper
I need to electrolessly plate nickel or copper onto polymethyl methacrylate (PMMA) and polycarbonate templates to create complex 3-D microstructures. PVD (sputtering and electron beam evaporation) can coat a seed layer for subsequent electroless plating. What metals work best as the seed layer in each case? How thick the PVD coating is required?
Also, dipping into palladium chloride and/or tin chloride solution is the most common practice in industry. Does it work on PMMA and polycarbonate substrates?
Any idea is appreciated.
LSU-Microsystems - Baton Rouge, Louisiana
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