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Blistered Plating at the Nickel Interface to Extruded Base Aluminium 6063

Extruded Aluminium (6063)that has been zincated (Twice), electroless nickel 2 microns and silver plated 6 microns. With a pre 200 and post 150 degree C bake is blistering at the alum interface.

Process to manufacturer guidelines I'm told.

Porosity none found.

Most blistering occurring after reflow soldering operation 230 degrees C for 1 minute

Any suggestions?

Bill Griffiths
- Cape Town, South Africa
2001

Dear Bill,

I did not understand, why you are using electroless nickel as an undercoat before silver? Remove electroless nickel before silver plating, you will probably solve the problem of blistering.

Greetings from Turkey!

FREDI YARCAN
- Istanbul, Turkey
2001

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