-- The Home Page of the Finishing Industry
Serious Education & the most FUN
you can have in metal finishing smiley

No popups, spam, registration or passwords
on this site
current topics
topic 8511

Problem in Electroless Ni/Au


We screen-printed a solder mask on our PCB boards and then sent for electroless nickel and gold plating. We hope Ni and Au can be selectively deposited on the area without the solder mask. It did work; however, when we tested the solderability we found the ball shear strength decreased significantly. SEM and EDX result after removing the solder ball shows the presence of a high phosphous content . It seems like the failure occurs at the NiP layer. But if we do not print solder mask and electroless plate Ni and Au, there is not any problem.

Eager for some valuable suggestions from your experts.

- HongKong, China


Did you get a solution for your question. If so can you share this with me because I am now having the same problem with solder mask peel because the nickel.

Claude Ebanks
STACI - Margate, Florida, USA

If you have a question in mind which seems off topic, please Search the Site

ADD a Comment to THIS thread START a NEW threadView CURRENT TOPICS

Disclaimer: It's not possible to diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations may be deliberately harmful.

  If you need a product/service, please check these Directories:

JobshopsCapital Equip. & Install'nChemicals & Consumables Consult'g, Train'g, SoftwareEnvironmental ComplianceTesting Svcs. & Devices

©1995-2018, Inc., Pine Beach, NJ   -   About   -  Privacy Policy
How Google uses data when you visit this site.