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topic 8511

Problem in Electroless Ni/Au



2001

We screen-printed a solder mask on our PCB boards and then sent for electroless nickel and gold plating. We hope Ni and Au can be selectively deposited on the area without the solder mask. It did work; however, when we tested the solderability we found the ball shear strength decreased significantly. SEM and EDX result after removing the solder ball shows the presence of a high phosphous content . It seems like the failure occurs at the NiP layer. But if we do not print solder mask and electroless plate Ni and Au, there is not any problem.

Eager for some valuable suggestions from your experts.

Ma ZH
- HongKong, China


2003

Did you get a solution for your question. If so can you share this with me because I am now having the same problem with solder mask peel because the nickel.

Claude Ebanks
STACI - Margate, Florida, USA

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