Strip to Strip Electroplating
I am working semiconductor solder plating area. Our plating machine is strip to strip plating. I met a problem, we found that there have exposed-copper at only one side leads shoulder (near the package). And we measure the thickness near the package found that this side thickness is much lower (about 100uinch) than the other three sides. How can improve the this side thickness?
AMD(Suzhou) - SuZhou, China
Try increasing your anode to cathode distance or shield the edges with wire to draw current away from the edge of the lead.
Vishay Thin Film, Inc. - Niagara Falls, NY
If you have a question in mind which seems off topic, please Search the Site