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Au/Sn solderability problem

We manufacture W/Cu & Mo/Cu materials for the electronics packaging market. These materials are typically plated with Soft gold over nickel for solderability. One of our customers is attaching die to our substrate using a 0.001" thick 80/20 Au/Sn preform. The gold plating on our sub-mount is 100 micro-inches thick. The Au/Sn is leaving excessive voids after reflow. Any ideas of what may be causing the poor solderability? Is the gold plating too thick?

Bob Cronk
Spectra-Mat, Inc. - Watsonville, CA , USA
2000

Is your customer using a plasma preclean process shortly before soldering? This could be important. Ask them to do a surface tension or wetting-angle test.

Mandar Sunthankar
- Fort Collins, Colorado
2000

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