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Electroplating onto sputtered Titanium & Copper thin films pulls them off

Q. Hello,
I am facing an issue in electroplating of copper, Nickel and Gold over the sputtered thin film of Titanium and Copper on Alumina substrate. We are depositing 60nm Titanium and 400nm of copper. Our Titanium and Copper have perfect adhesion with each other and Alumina substrate when it is sputtered. However, when we do the electroplating of copper/Nickel on this layer, the sputtered film get pilled off from Alumina substrate. Please let me know, the probable reasons behind this and how we can prevent this pilling of sputtered thin film. We are using acid copper sulphate [on eBay or Amazon]bath or copper Rochelle salt bath for copper electroplating and Nickel sulfamate bath for Nickel deposition.

Thank you in anticipation

SHRIKANT KULKARNI
- PUNE INDIA
September 9, 2023




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