No passwords, no registration, no paywalls, no popups, no AI

As an Amazon Associate & eBay Partner we earn from affil links

finishing.com -- The Home Page of the Finishing Industry

Search our quarter-million Q&As

Home of the finishing HOTLINE since 1989

-----

Hardness measurement of brittle materials

I'm a graduate student in Materials Science and I am interested in measuring the hardness of SiC. More specifically, I'd like to do the test on SiC wafers of about half mm thickness.

I tried using an indentor but the only result was to cleave the wafer.

Is there any other way to measure the hardness on brittle materials?

I would appreciate any help on this issue. Many thanks in advance.

Mihaela Balseanu
Cornell University - Ithaca, New York
2000

Assuming that you have a very smooth surface finish, you need a microindenter or nanoindenter instrument with a microscope set up to measure hardness of such a material. Such a hardness measurement service is provided by many labs. Check with KTA-TATOR in Chicago, e.g.

Mandar Sunthankar
- Fort Collins, Colorado
2000

Sorry! Finishing.com is temporarily Read-Only.
Ted Mooney is retiring but I have several offers to take it over.
We're working hard to make sure we find it the best new home.

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: