Aloha, fun & authoritative answers -- no cost, no passwords, no popups
(as an eBay Partner & Amazon Affiliate we earn from qualifying purchases)

Metal finishing Q&As since 1989

-----

Adhesion of vacuum evaporated Sn on Ti evaporated adhesion layer

February 10, 2016

Q. I am trying to deposit 50nm thick Sn layer on Silicon wafer using Vacuum evaporation (1A/sec of deposition rate) using 50nm thick Ti layer underneath as an adhesion layer. Ti layer adheres well to Silicon, but Sn layer can be wiped off by finger easily. Vacuum pressure before Sn deposition is 1E-7 but it will degrade to 1E-6 level. I tried heating Silicon wafer up to 120 °C before Ti deposition as well as during Sn deposition. This didn't help adhesion of Sn. Sn layer doesn't de-laminate, just be wiped out by finger.
Any brilliant suggestion?

Tatsuo Nakato

(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: