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-----NiPdAu and NiPd Plating
Recently I need to study the performance of PPF for assembly industry, would like to understand what is the major differences of NiPdAu and NiPd in terms of Wire Bond and solderability. Why do we need Au if NiPd is able to perform? Do I understand that Pd easily pasivates and thus we need Au to prevent it? Normally, during solderability, the PdAu is easily soluble and the solder is actually on the Ni layer? Can somebody pls clear my doubts?
Thanks and regards,
Material Engineer - Penang, Malaysia
September 23, 2011
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