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Why does tin plating peel off of 2 parts out of two thousand?

I am a plating engineer in IC manufacturing. Our process is pure tin plating using rack automatic plating machine. Sometimes we are experiencing plating peel-off on our work, but what surprises me is that in a 2016-unit lot, there are only 2-4 units with peel-off. To think that these 2016 units underwent the same process and pre-treatment is very strange.
Please comment on this post if you are/have experienced this before and what were your actions to prevent such.

Charie Bistayan
plating engineer - Clark, Philippines
June 24, 2011

June 24, 2011

Hi Charie,

Not sure peel off is happened right after tin plating or trim & form. If peeling around lead bending area after trim & form, then could be due to too small and/or irregular tin grain size arise from imbalance of additives and/or organic/metallic contamination inside tin plating solution.

If peeling right after tin plating, then you may focus on pretreatment esp. mold deflash & mild etch to ensure IC substrate is free of mold flash and/or other residues prior tin plating.

Regards,
David

David Shiu
- Singapore

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