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Solderability Problem with ENIG Finish on PCB

May 25, 2011

We are using ENIG finish for Pb-free PCB assembly. We are having both side SMD population, we have noticed that during Top side reflow for few SMD components wetting not proper, and it is not for same component . And during PTH component hand soldering , PTH not filled and not covering 100 % pad of PTH ?

PCB supplier's reports shows thickness of nickel and Gold as per IPC standard.
Can some body explain us, reasons for same.

Prakash Patil
consultancy services - Mapusa-Goa, India

May 27, 2011

Hi Prakash,

Besides thickness, other properties like nickel corrosion (so called black nickel), P% in EN deposit and IG porosity may also play a part. Of course, solder paste quality and reflow profile setting are important too.

Regards,
David

David Shiu
- Singapore

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