Factors Affecting Stripping Rate of Dry Film
I would like to ask what are the factors attributing to the incomplete stripping of thick dry film (on copper substrate); we are using about 1.5 %KOH for stripping.
Does the conc. of OH affecting the power or any other factors such as the cleanliness of substrate before laminations?
Thanks. in advance
Eric LamEric Lam
There are several factors for stripping dry resist for example temperature, spray pressure and the make up of your solution. You should have a data sheet for your resist, where all parameters are described. If you do not have one get one. Good luck MarcusMarcus Hahn
- Sachseln Switzerland
The KOH conc. mainly affects the size of the resist skins formed. Incomplete stripping can be due to a lot of factors; temperature being one of the most important. You don't say if you are stripping in a tank or a conveyor, and you don't mention the possibility of overplating locking in resist chips between traces. These areas are just a few of the possibilities.
- Tallahassee, Florida
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