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Copper electroplating onto tantalum sputtered silicon substrate

Hello. I'm currently doing a project to characterise copper delayering. I need to electroplate a layer of copper onto a thin layer of Ta which is being sputtered on a 2" blanket silicon wafer. I've tried to electroplate at a constant voltage of -1V and -2V for 1 hr. However, it doesn't seem to plate onto the surface. The electrolyte is made up of Cu2SO4.5H2O and H2SO4. Hence, I need help on this so that I can proceed with my research. Thank you.

mz ng
student - Singapore
October 8, 2009

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