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topic 5371

Pulsed Copper (and Tin) Properties


(2000)

Hi!
I'm thinking about initiating some pulse-plating and I'd like to get some background information on pulsed copper (circuit board work, etc.) and also tin electrodeposition. For example, what sort of advantages can pulsing offer versus D.C.? Can better throwing power be achieved? Is there substantial grain refinement? What are the associated physical properties of pulsed Cu (and/or Sn) deposits?

Thanks very much!

Ian Brooks
- Toronto, Ontario, Canada


Theory and Practice of Pulse Plating

(2000)

I would get a hold of the proceedings from pulse plating symposiums from the nasf.org. Or contact suppliers of pulse plating equipment for reprints.

tom pullizzi portrait
Tom Pullizzi
Falls Township, Pennsylvania


(2000)

Hi,

Pulse plating can offer better throwing power and also better distribution. High current density areas (isolated tracks etc) will not plate as high as with DC. Typically, due to the fast breakdown of additives, the organic contamination will cause poor elongation.The grain structure becomes "rough".You will increase productivity due to the fact you are running with high amperage.You are also able to reduce the thickness of your solder mask since the tracks will be reduced.

Peter [last name deleted for privacy by Editor]
- Sweden



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