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Problem in tin plating

We are using Ni as barrier between Brass and Tin. At the time of wave soldering of this part on PCB, its tin plating is removed. that is not acceptable. please suggest the solution.
For the wave soldering preheat temp. is 300 °C and solder temp. is 250 C.

Rahul Sharma
buyer - Udaipur, Rajasthan, India
October 17, 2008

Rahul,
Because of the higher temperatures used in lead free soldering, an adjustment has to be made in the flux. I remember we had to increase the rosin content and lower the solvent content. This was accomplished by our supplier of solder/flux. A thicker tin deposit and a longer dwell time in the pre-heat will help too. Are you sure the pre-heat temp is that high? I hope this helps you.

Mark Baker
Process Engineer - Syracuse, New York
October 23, 2008

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