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Titanium pretreatment for copper deposition from a sulphate bath

I am looking to prepare a copper deposit on a freshly polished (50nm alumina suspension) titanium surface. Although published works by Natter and Hempelmann claim that they achieved a highly adhesive interaction of the Cu and the Ti, I have not. I am not particularly concerned with the cohesion to the Ti surface but that the Cu layer by continuous. Please help with any details.

Greg Clayson
- Raleigh, North Carolina
2000

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