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-----Good adhesion material for Si substrate and Gold?
I'd like to deposit Gold on Si substrate. But, the adhesion between the Gold and Si isn't good. So, I used Ti for good adhesion. However, the problem is the Ti is hard to deposit in evaporator. Is there any other metal that substitute the Ti?
Kwang AnU. of M. - Ann Arbor
2006
I believe Ti is the most common adhesion layer for gold evaporation. I know we use Ti with Au and Si all the time in our evaporation system, with no problem. I have also heard of using chrome and then gold in an evaporator, but I have no experience with that. You might also look into nickel.
Brad Blakestad- Boulder, Colorado, USA
2006
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