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Electrolytic Ni/Au plating on PCB causing low thickness of Cu

We are plating 200 to 400 microinch Ni and 60 microinch of Au on a Double sided PCB board. It has selective Plating. We mask while plating Ni /Au and those masked pads through which current is flowing turn darker colour and when we treat the surface sometimes can be fully etched off. Those pads through which no currnet if flowing has no problem. Can anyone explain Why and how to over come this issue.

Nirmala
Flexible PCB manuafcturer - Malaysia
2006

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Nirmala,
Is it possible that there is solution seeping in under the masking during plating? What is your masking procedure? Are you tenting with photo resist, or are you using Ni-Au plating tape? If using tape can you bake it and press roll it? Need some more details here, let me know.

Mark Baker
Process Engineer - Syracuse, New York
2006

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