Aloha, fun & authoritative answers -- no cost, no registration, no passwords, no popups
(as an eBay Partner & Amazon Affiliate we earn from qualifying purchases)

Where the
world gathers for metal finishing
Q&As since 1989

-----

Electrolytic Ni/Au plating on PCB causing low thickness of Cu

We are plating 200 to 400 microinch Ni and 60 microinch of Au on a Double sided PCB board. It has selective Plating. We mask while plating Ni /Au and those masked pads through which current is flowing turn darker colour and when we treat the surface sometimes can be fully etched off. Those pads through which no currnet if flowing has no problem. Can anyone explain Why and how to over come this issue.

Nirmala
Flexible PCB manuafcturer - Malaysia
2006

Nirmala,
Is it possible that there is solution seeping in under the masking during plating? What is your masking procedure? Are you tenting with photo resist, or are you using Ni-Au plating tape? If using tape can you bake it and press roll it? Need some more details here, let me know.

Mark Baker
Process Engineer - Syracuse, New York
2006

(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: