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Metal Plating

I am performing copper plating with acid bath in the photoresist mould on Si wafer for making coils. Till now I was getting uniform plating. Now after a gap of 5 months I am using again the same bath, same current density. I am getting lot of over growth due to which my coils are getting joined to each other. How to solve this problem? What is to be done to get uniform plating .

Sriram.B
Research fellow - Bangalore, India
2006

Do you mean the bath is idle for 5 months without any plating? If so, it could be due to organic by-product build up and you need to perform carbon treatment to remove organic contamination and adjust bath components according to chemical supplier's specification.

David Shiu
- Singapore
2006

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