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Tin/Lead Electroplate Over Nickel - Recommendations?



(-----) 2006

We have a terminal made from Alloy 52 that gets soldered to a printed circuit board, and are curious as to what the recommended/optimum process thicknesses are for the nickel barrier and the Tin/Lead electroplate. TIA for insights and assistance....

Mike McMonagle
End User - Houston, Texas
^


2006

I would recommend keeping the nickel thickness between 3 to 5 microns and the SnPb thickness of between 5 to 7 microns.

Poobalan
- Singapore
^

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