We want do lead sheathing on copper terminals. We hold the latter in moulds an cast the lead around in thickness fro 2.5-5 mm all around. We are unable to get good bonding and the junction resistance is also high. Electroplating the copper pieces with tin caused blister after casting.Can one suggest some surface treatment on the copper to get a good mechanical bonding with lead to minimize the junction electrical resistance.
SUMIT BASU BATTERY MAKING - Hyderabad, Andhra Pradesh, India
Try ordinary soldering flux, obtainable from any plumbing shop or speak to your local solder supplier.
Geoff Smith Hampshire, England
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