I have a question about copper pretreatment. The substrate is 97-99% copper and the rack is stainless steel (306). The pretreatment is clean, 10 H2SO4, PdCl dip (activator) and plate. When the copper parts are racked on the stainless steel, I get a cloudy deposit, and when the copper parts are plated in a CPVC basket, the deposit is perfect. There seems to be a problem with the stainless steel in the PdCl solution, if so what is the cause of this problem. I have the same cloudy deposit after nickel striking the racked parts. Has anyone seen this problem.
Thank you for your advise.
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