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Product stick to barrel electrode

We are manufacturer of chip resistors and electroplating is part of the process. We utilize barrel plating to deposit nickel follow by pure Tin on the terminals of the resistors. Recently we found resistor and steel balls stick to the barrel cathode electrodes during the unloading of the parts after plating. We have tried different method to rectify this problem, example: controling the dosage of Tin brightener and wetting additive, different barrel electrode angle, etc. but the problem re-appear after stabilizing for sometime. I would like to find out whether anyone have the same experience and share with me.

Wilson
Chip Resistor Plating - Singapore
2005
publicly reply to Wilson

Can you increase the barrel speed very slightly without damaging your parts?

James Watts
- Navarre, Florida
2005
publicly reply to James Watts

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Dear Wilson:

We are manufacturer of chip resistors too. We have taken several successful measures for resolving product and chip sticking to electrode.
first,the volume of chip and steel balls can't too little to cover cathode electrode.
second,barrel can't rotate on the contrary.
third,Tin plating bath may be activated by several barrels of steel balls.

Yichun-ni
Cyntec(China) - China
2006
publicly reply to Yichun-ni

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