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-----PDIP 8 Leads clear package processing electroplating?
2005
We experience internal package crack after solder plating. The crack is most common at the tie bar area and the lead fingers just near the stitch bond area. we suspect that the cracking is induced by the current applied during electrodeflash. the chemical we use is potassium hydroxide based and apply a current of 170A for each of the
4 rectifier of MECO which is standard for PDIP Black package. The molding compound we use is MG-18 hysol clear compound.
Is it possible that the crack is induce by the deflash current?Is the molding compound that sensitive to chemicals or current applied during deflashing? the molding compound has undergone Post mold cure already.
Semiconductor - Mold and Plating Engineer - Philippines
Hello Jao, Mike,
I think you need to consult your molding compound supplier to find out the properties of the MG-18 compound. Basically, a properly cured mold will resist attack from deflashing chemicals, however, a clear compound maybe is different. You can try a neutral deflashing chemical for your ED. It is available in the market. It may solve your problem.
- Laguna, Philippines
2005
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