
Thread 367/51
Copper plating of palladium
Could one tell me if the amount of formaldehyde to be used as a reducing agent should be added to the copper plating solution in one go or incremently?
thanks
Manchester University - Manchester, England
2005
publicly reply to Joey Smith
It should be added as described on the technical data sheet supplied by the vendor of the proprietary electroless copper chemistry, Joey. Don't waste your limited experimental time trying to develop home-brew electroless plating baths. Good luck.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
2005
publicly reply to Ted Mooney
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