"Copper plating of palladium"

2005

Could one tell me if the amount of formaldehyde to be used as a reducing agent should be added to the copper plating solution in one go or incremently?
thanks

Joey Smith
Manchester University - Manchester, England
^

2005

It should be added as described on the technical data sheet supplied by the vendor of the proprietary electroless copper chemistry, Joey. Don't waste your limited experimental time trying to develop home-brew electroless plating baths. Good luck.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
^

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