Sputter coating vs ion implantation

I am a tutor and I'm going to do a research, developing a high temperature material fe-al based alloy using the powder metallurgy and surface treatment, ion implantation.

I wanted to ask what is the differences between the sputter coating and ion implantation?

Thanks,

Sputtering is a coating process where material is removed from one surface (target) and the same is deposited on another (substrate). The typical energy used to remove atoms is about a few eV. There is little chemical interaction between surface and coating (in most cases).

In ion implantation, atoms of a gas or metal are ionized (by stripping electrons), then accelerated under high (100kV to >1 mil kV) electric field so they can penetrate the surface and get lodged in the crystal structure. In spite of high energy, the depth of atoms is only a few tenths of angstoms (depths varies with applied voltage).