No passwords, no registration, no paywalls, no popups, no AI

As an Amazon Associate & eBay Partner we earn from affil links

finishing.com -- The Home Page of the Finishing Industry

Search our quarter-million Q&As

Home of the finishing HOTLINE since 1989

-----

Voids Resulting After The Reaction Of Nickel-plated Copper and Solder Paste

2005

hi!

I am a college instructor here in the Philippines. the name of the school is university of san carlos. actually, I would like to know the effects or the reaction between nickel plated copper and solder paste. is there voids after it? how to get rid of it?

thank you.

walton

walton b. lacorte
university of san carlos - Philippines

Yes,voids may appear in the system (joint). Solder paste has additives in it and during reflow outgassing is one major problem. When entrapped, this results to solder voiding.
However, this is a function "Die Attach" settings (temperature and time), you may want to play on this to address the problem.

Jerwin Separa
assembly and test of semiconductor - Metro Manila, Philippines
2007

Sorry! Finishing.com is temporarily Read-Only.
Ted Mooney is retiring but I have several offers to take it over.
We're working hard to make sure we find it the best new home.

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: