Acid Copper Bond on Nickel Substrate

We electroform acid copper on nickel. We have found that copper bonds to nickel in two cases. We get a good bond if we go directly from sulfamate nickel electroforming into an acid copper bath with no delay. We also get a good bond on "passive" nickel if we use an acid etch combined with a woods nickel strike prior to entering acid copper. Is there any strike that is non electrolytic, so we can avoid shields or masking during the woods nickel strike? Also, is there a strike that is different in color from nickel? An example would be electroless gold (if it worked).

A Woods Nickel Strike (high chloride) is so inefficient that I can not see why you would need shields for it. Electroless goes everywhere, so you can not avoid masking as I understand your question. You just can not beat a Woods strike on nickel parts. The woods strike is slightly tan or buff. You can tell the difference from good sulfamate nickel fairly easily, but not from a distance or on the fly.