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topic 3532

DIE ATTACH DELAMINATION


(1999)

WOULD LIKE TO SEEK YOUR OPINIONS RE D/A DELAMINATION ON SOFT SOLDER PROBLEMS WE HAD ENCOUNTERED. WAS ABLE TO PERFORM EDX ON THE DIE BACKSIDE OF THE SAMPLE REJECT AND THE FOLLOWING ELEMENTS WERE TRACED: Si, Al, Cu, C, and O. DO YOU THINK Al WAS THE MAJOR SOURCE OF DELAM? IF YES, WHY?

JOJO VICTORIO
- MANILA, PHILS


(1999)

We will need more information Jojo or maybe I just don't understand.

What is the composition of the solder?
What is the solder temperature?
Is a flux used and if so what type?
Are the surfaces cleaned prior to soldering.
What materials are you soldering together?

Aluminum is a difficult material to solder because of the oxide that it forms. A chromate or phosphate coating may help.

Rick Richardson, MSF
Techmetals Inc.
supporting advertiser
Dayton, Ohio
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