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Delamination of PdNi from Ni undercoat on connector contact

I am experiencing delamination of PdNi from Ni substrate for connector contacts. Experiments including increasing voltage of PdNi bath can result in some "burning" of the plating, but the actual result of experiment, that is, severity and appearance of delam, do not correlate to original defective material. Some Si was detected at the PdNi to Ni interface. This could be from the mask which has been used for a long period of time. Can this mask change somehow to now contribute this as a contaminant? Thank You.

Stephen White
- Rochester, Minnesota, USA
2005

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Sounds like contamination from the mask to me. Try thoroughly cleaning the mask.

Trevor Crichton
R&D practical scientist
Chesham, Bucks, UK
2005

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To get adhesion to a nickel substrate a low pH nickel strike is required prior to plating NiPd. Woods strike is 32 oz/gal nickel chloride and 12 fl oz/gal hydrochloric acid. 50-100 amps/sq ft., quick rinse and NiPd plate.

Don Baudrand
Consultant - Poulsbo, Washington
(Don is co-author of "Plating on Plastics" [on Amazon or AbeBooks affil links]
           and "Plating ABS Plastics" [on Amazon or eBay or AbeBooks affil links])
2005