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Better uniformity for gold electroplating on wafer?

2004

I would like to achieve gold plating thickness can be controlled within 2.5 µm (± 5 %) across a 6 inches wafer. Is there any positive advice out there for me to achieve this or better uniformity?

I've been looking for solution to improve the uniformity for electroplating gold on Si-wafer. Recently I had found a website which claiming an innovative design I have never seen before. Seems like a small size (bench-top I think) electroplater in lab. Please follow this link to take a look ( http://www.geocities.com/lab_plater ). I am in doubt could the agitation scheme be helpful to improve my wafer plating uniformity or in turn the overall yield. Would like to hear from someone who is experienced in wafer plating whether the scheme they have mentioned make sense or could there be some other concern. Cos� I will need to invest/modify my plating bath within limited budget.

Yours advice would be much appreciated.

Matt Johnson
student - Sunnyvale, California, USA

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