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Ni Plating Brightness vs. Ductility
We are using electrolytically Ni-plated Cu alloys as leadframes for our transistor packages. Ni plating is semi-bright (according to supplier) with brightness min 46% Dr. Lange. However, using this specs, we encounter some plating peel-off during bending of the leadframe leads, and we try to factor in the brightness of the Ni plating. Does Ni plating brightness tell anything about the plating hardness or ductility?
Appreciate your comments
Best Regards,Jun Idjao
Philips Semiconductors Philippines, Inc. - Laguna, Luzon, Philippines
I have found that excessive brightener will cause ductility problems especially sulfer bearing compounds.
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- Hobart, Tasmania, Australia