No passwords, no registration, no paywalls, no popups, no AI

As an Amazon Associate & eBay Partner we earn from affil links

finishing.com -- The Home Page of the Finishing Industry

Search our quarter-million Q&As

Home of the finishing HOTLINE since 1989

-----

de-wetting of short leads, only, in tin dip process

Q. Using a tin dip process we encountered de-wetting on short leads only and none at all at high leads, what do you think is the problem? how to avoid de-wetting?

June Apolinar
student - Makati City, Philippines
2004

A. de-wetting is generally caused by a contamination problem. An interruption occurs in the orderly growth of the intermetallic compound because of the presence of some unwettable material on or near the surface of the base metal. The base metal is covered by a layer of molten solder, which pulls back from the unwetted areas. The result is a thin <1 µm layer of intermetallic compound covered with little or no solder. If you are plating your own parts prior to solder process, make sure that you have a very clean, activated base metal preparation prior to final plate (gold?).

Tess Molina
- Hawthorne, California, USA
2004

Sorry! Finishing.com is temporarily Read-Only.
Ted Mooney is retiring but I have several offers to take it over.
We're working hard to make sure we find it the best new home.

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: