Summary for solder plating vs solder dip Discussion
Solder plating vs. solder dip is discussed in terms of how each method applies tin or tin-lead finishes to a Single In Line package. Joel M. Supnet asks about converting from solder dip to solder plating and wants the advantages and disadvantages of each. In response, Tess Molina explains that tin and tin-lead deposits can be made either by electroplating or by hot dipping in molten metal. She notes that electroplated deposits have the advantage of uniform, reproducible coatings in the desired or specified thickness. By contrast, immersion deposition can also produce tin and tin-lead on certain base metals, but the deposits are relatively thin. The answer suggests that plating is better when controlled thickness and consistency matter, while dipping is a simpler route that may yield thinner coatings.
Q. Currently our process in plating a Single In Line package is solder dip, I want to convert it to solder plating. Just like to know the (dis)advantages between the two process.
Joel M. Supnet
solder Plating or dip – Cabuyao, Laguna, Philippines
2004
A. Tin and Tin-Lead deposits can be produced either electroplating or by hot dipping in molten metal. Electroplated deposits provide the advantage of uniform, reproducible coatings in the desired or specified thickness. The electroplating process, however, is used extensively for the continuous strip coating of steel product. On certain base metals, tin and tin lead deposits can also be produced by immersion deposition, but the deposits are relatively thin.
Tess Molina
– Hawthorne, California, USA
2004