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Zinc migration concerns when soldering brass components

I am a quality manager at a contract manufacturer of electronic circuit boards. I have a question regarding the solderability of a part we are being asked to use on one of our customer's products.

The part is a spade connector made of brass with a 95.5/.5 tin/lead top plate. The solder paste used is 62/36/2 tin/lead/silver. My concern is the effect of zinc migration on the reliability of the solder joint over time. The joint looks acceptable (good wetting, etc.) after subjecting it to our re-flow process. Should I be concerned with long term effects of zinc migration after soldering these components on the PWB?

Kevin Noyce
Electronics Mfgr - Ironwood, Michigan
2004

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