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How to shorten the plating time for acid copper

Hello,

I am a beginner in electroplating and in need of information about shorten the time of acid based copper plating. The following is the current setting: ANODE: copper nuggets (fully immersed in the tank), CATHODE: Steel base cylinder that has been previously coated with Nickel (half immersed in the tank and rotating at certain speed).

ELECTROLYTE: CuSO4, H2SO4, and additive dosing.
SETTING: I set the current density at 22 A/dm2.
Average plating time = 120 - 200 min.

I have tried to increase the current density to 25, but it resulted in roughness on the cylinder surface. Same thing happen as I increased the temperature. I have tried other parameters as well, but nothing seems to shorten the plating time (maybe decrease it to 60 - 70 min?), so I am wondering if anybody have any clue? Thanks in advance!

Fedrick Tanuddin
Student - Jakarta, Java, Indonesia
2004

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Hi Fedrick. This answer is so obvious that there is probably a good reason why you're not doing it: fully submerge the cylinder rather than half submersing it :-)

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
2004