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PCB plating voids. Caused by air bubbles?

Q. I am looking for the common causes of plating voids in the PTH of circuit boards. Particularly, I am wondering if all voids tend to be caused by air bubbles or not. What other modes of failure are common? Where are the bubbles in the vias originating from? Could bubbles in the solution move into a hole and cause the plating void? Can the bubble be moved out by agitation systems?

Jimmy Fang
Circuit Board Manufacturing - Kunshan, JiangSu, China
2003

Yes, gas bubbles can cause voids in the PTH, but they are not a usual cause. You need both air and mechanical agitation in the electroless Cu bath, and good mechanical through hole agitation will generally eliminate bubbles as a void cause. That being said, there are too many other causes for voids to discuss for free; I suggest you contact your chemistry vendor for assistance.

James Totter, CEF
- Tallahassee, Florida
2003

Q. Dear sir,
I have detected many problems of air bubbles in the PCB's, and I am unable to find out the appropriate cause as well as solution. Please suggest what are the possible causes of this so that according to that we can take appropriate decision.

Lokesh Kumar
Energy metering company - jaipur,rajasthan. India
August 13, 2012

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