Palladium Chloride electroless strike on silicon

I am electroless plating nickel on silicon semiconductors (Diodes). I am using Palladium chloride for the strike. I can not decide if the Palladium chloride solution should be acidic or basic, they both work. I need an opinion on what is better (I do not have sufficient experience to decide). Please explain the reasoning that supports the opinion, so that I may understand.

Thank You,

I have never done this, so take the advice with caution! However, silicon will dissolve in hot alkali, so using the alkali process may enhance adhesion by etching the surface of what is often a very well defined and chemically equipotentialised surface. However, if both acid and alkaline routes meet your requirements, chose the simpler and cheaper one.