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-----Wet etching of Sputtered Tantalum film
2003
Hi,
I'm trying to etch Sputtered Tantalum films about 1500 Ang thick. The HF:HNO3 in ratio 1:3 is a good etchant along with PR. But this corrodes the other underlaying Al2O3(reactive DC) and SiO2 layers. Is there any other fast etchant with good selectivity considering that
1:1 1M EDTA:H202 and NaOH/KOH:H2O2 etch rates are low and selectivity is very bad.
Regards,
University of Central Florida - Orlando, Florida
Does anyone know the selectivity of SiC to Ta?
Terry K. Daly- Tempe, Arizona
2004
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