Sintering the natural diamond for wire drawing dies

We want to hold the natural diamond in some hard metal matrix either by sintering or metallizing process for making wire drawing dies. wettability of diamond is very low. So it is hard to stick the metal with the diamond so as to pass the heat generated during wire drawing process. The metal matrix in which diamond is hold should be hard enough to withstand the pulling load during the wire drawing process. Diamond can withstand only 500 °C temperature. So this sintering process should be carried out at low temperature.

Any suggestion or machine vendor hint is appreciated.

Try co-depositing diamond with hard nickel. You may also consider using high phosphorus electroless nickel with the diamond as a composite. Both technologies are reasonably well known.