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"Whisker - Pure t Tin"

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2003

Ladies & gentlemen,

Currently is there any standard testing methods to drive the growth of whisker for pure tin plating? There's lots of different thermal-cycling conditions, (e.g. -40C~125C, -40C~85C, -40C~155C, ...), which one shall we choose?

Beside, any standard methods to analyse the %of Pb in the deposit of Sn?

Thank you very much for your helpful hand.

Thanks!

Wymen Lee
- Georgetown, Penang, Malaysia

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2003

I am not understanding you. You are trying to grow tin whiskers?

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey

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2003

I am too removed from this subject to be current on specs, but the little devils(whiskers)want a compressively stressed situation. I forget the other important factors and I hope others will help. You mention Pb. Co-deposit 3% and you meet an old Mil spec I recall. This is enough to greatly inhibit whisker growth. Also tin/bismuth will do same.

Jon Quirt
- Minneapolis, Minnesota

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2003

Hey!

I think you are conduct lead-free solder plating and you want to measure pb composition on your product and reliability test (thermal cycling test) to qualify your lead-free solder bath. I also do the same things as you. Hope we can exchange information.

Kenny
- Malaysia

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2003

Yes! Kenny, you got it. Ya, I wish that we might exchange some information on this.

Best Regards,

Wymen Lee
- George Town, Penang, Malaysia