Home /
T.O.C.
FAQs
 
Good
Books
Ref.
Libr.
Advertise
Here
Help
Wanted
Current
Q&A's
Search 🔍
the Site
pub Where the world gathers for
plating, anodizing, & finishing Q&As since 1989







-----

Au wire bonding question



2003

Q. I need to know whether immersion Au plating has been used for wire bonding application. Our specification for Au thickness is 0.5 micron. Can immersion process provide sufficient Au thickness that is required for wire bonding application?

Vahid Goudarzi
- Fort Lauderdale, Florida, USA



2003

A. Please visit SMTnet This site has in depth research information under electronics forum. You need to search for immersion gold or wire bonding. Alternately, please check a book by Mr.Harman, "Wire Bonding in Microelectronics" [affil. link to book on Amazon] published by McGraw Hill. We have a wire bonder and we have info gathered from experienced platers. I can try to answer your specific questions.

Thanks,

RAMANAND KINI
- India



2003

A. Did you get the information from SMTNET? The MIL standard for wire bond strength is MIL-Std-883 [affil. link].

RAMANAND KINI
- India


none
finishing.com is made possible by ...
this text gets replaced with bannerText
spacer gets replaced with bannerImages

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories:

 
Jobshops
Capital
Equipment
Chemicals &
Consumables
Consult'g, Train'g
& Software


About/Contact    -    Privacy Policy    -    ©1995-2023 finishing.com, Pine Beach, New Jersey, USA