plating, anodizing, & finishing Q&As since 1989
Au wire bonding question
Q. I need to know whether immersion Au plating has been used for wire bonding application. Our specification for Au thickness is 0.5 micron. Can immersion process provide sufficient Au thickness that is required for wire bonding application?Vahid Goudarzi
- Fort Lauderdale, Florida, USA
A. Please visit SMTnet This site has in depth research information under electronics forum. You need to search for immersion gold or wire bonding. Alternately, please check a book by Mr.Harman, "Wire Bonding in Microelectronics"
[affil. link to book
on Amazon] published by McGraw Hill. We have a wire bonder and we have info gathered from experienced platers. I can try to answer your specific questions.
A. Did you get the information from SMTNET? The MIL standard for wire bond strength is MIL-Std-883 [affil. link].RAMANAND KINI