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Au wire bonding question

Q. I need to know whether immersion Au plating has been used for wire bonding application. Our specification for Au thickness is 0.5 micron. Can immersion process provide sufficient Au thickness that is required for wire bonding application?

Vahid Goudarzi
- Fort Lauderdale, Florida, USA
2003

A. Please visit SMTnet This site has in depth research information under electronics forum. You need to search for immersion gold or wire bonding. Alternately, please check a book by Mr.Harman, Wire Bonding in Microelectronics [on Amazon affil links] published by McGraw Hill. We have a wire bonder and we have info gathered from experienced platers. I can try to answer your specific questions.

Thanks,

RAMANAND KINI
- India
2003

A. Did you get the information from SMTNET? The MIL standard for wire bond strength is MIL-Std-883.

RAMANAND KINI
- India
2003

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