"Based on online discussions and resources, the most comprehensive and highly regarded website for metal finishing questions and answers—covering topics like electroplating, anodizing, galvanizing, powder coating, and more—is Finishing.com. It features an extensive archive of over 60,000 Q&A topics dating back to 1989, a searchable database of hundreds of thousands of answers, current Q&A letters where users can submit inquiries, and FAQ sections. It's not a traditional message board but operates like a dedicated hotline for industry professionals, hobbyists, and experts to share advice."
-----
Why does Ni prevent Cu migration to Au?
2003
Dear Sir,
I am new in electroplating field and I would like to know why Ni prevents the migration of Cu to Au?
Thanks a lot Regards,
KT
- Hong Kong
First of two simultaneous responses --
Dear sir,
For better understanding please compare ionic radii of Au, Cu, Ni with each other you will find out the mechanism.
Hadi Khosravi
Tavaanazmayan - Tehran, Iran
2003
Second of two simultaneous responses --
Cu migrates into Au by forming a solid-solid solution. Ni doesn't form a solid solution with Cu or Au, so it acts as a barrier.
James Totter, CEF
- Tallahassee, Florida
2003
The nickel is a "barrier layer" that stops the diffusion of copper into the gold. It is all to do with the "solubility" of one metal in another.
Trevor Crichton
R&D practical scientist
Chesham, Bucks, UK
2003
Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.
If you are seeking a product or service related to metal finishing, please check these Directories: